~ RRP Electronics, specializing in semiconductor assembly and testing, will leverage Deca’s advanced wafer-level packaging solutions to elevate its semiconductor capabilities.
~ Targets USD 30 Million in Year Two, Aims to Propel India’s Semiconductor Industry ~
In a groundbreaking move for India’s semiconductor sector, RRP Electronics, backed by cricketing legend Sachin Tendulkar, has forged a strategic alliance with US-based Deca Technologies, Inc. to supercharge its wafer-level packaging capabilities. This partnership marks a significant milestone in India’s journey to becoming a global semiconductor powerhouse.
Under this collaboration, RRP Electronics—renowned for its expertise in assembling and testing semiconductor components—will integrate Deca’s cutting-edge Wafer-Level Chip Scale Packaging (WLCSP) and M-Series™️ Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes. This will elevate the company’s ability to deliver high-performance semiconductor solutions to customers worldwide.
Deca Technologies, a leader in advanced semiconductor packaging with backing from industry giants like Qualcomm, Infineon, and ASE Group, sees this alliance as a gateway to India’s booming electronics and semiconductor ecosystem.
A Leap Toward Semiconductor Excellence Electronics is already making waves in the sector, currently collaborating on a prestigious project for a Swiss client, producing sophisticated Application-Specific Integrated Circuits (ASICs) in QFN packages. This further cements its reputation for delivering precision and innovation in high-tech electronics.
Rajendra K. Chodankar, Chairman & CEO of RRP Electronics, expressed his enthusiasm for the collaboration, stating “We are investing in a large-scale Technology Transfer License Agreement (TTLA) with Deca, potentially on exclusive terms, to create a fully automated, world-class infrastructure. This partnership will take semiconductor packaging in India to new heights. We aim to complete our qualification tests by August 2025 and foresee revenue exceeding USD 30 million (about ₹260 crore) in just the second year of operations, with exponential growth in the years to come”
Tim Olson, Founder & CEO of Deca Technologies, added “We are thrilled to be part of India’s ambitious semiconductor growth story. RRP Electronics’ vision, expertise, and determination make them the perfect partner to drive innovation in semiconductor packaging. This collaboration will accelerate their ambitious plans and strengthen India’s position in the global semiconductor value chain“
A Game-Changer for India’s Semiconductor Industry Beyond this partnership, RRP Electronics is spearheading a massive ₹12,035 crore, phase 1 Outsourced Semiconductor Assembly Test (OSAT) initiative, and 24000 crore fab set to establish a cutting-edge semiconductor manufacturing and assembly facility in Maharashtra. The Government of Maharashtra is backing this initiative, recognizing its potential to drive economic growth and technological advancement in the region.
In September 2024, RRP Electronics inaugurated a world-class facility equipped with next-generation manufacturing technology. This initiative is expected to create around 4,000 jobs, bolstering the local economy and cementing Maharashtra’s status as a global semiconductor hub.
As India accelerates its semiconductor ambitions, RRP Electronics and Deca Technologies are poised to redefine the landscape, bringing cutting-edge packaging solutions, massive job creation, and a new era of technological leadership to the country.
